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3-D Thin film interposer based on TGV (Through Glass Vias): An alternative to Si-interposer

https://doi.org/10.1109/ectc.2010.5490887
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1007/978-0-387-78219-5_16openalex-snapshot
Wafer Level Chip Scale Packaging
inferredcites →https://doi.org/10.1016/j.mee.2005.07.006openalex-snapshot
Deep dry etching of borosilicate glass using SF6 and SF6/Ar inductively coupled plasmas
inferredcites →https://doi.org/10.1109/ectc.2004.1319435openalex-snapshot
New wafer-level-packaging technology using silicon-via-contacts for optical and other sensor applications
inferredcites →https://doi.org/10.1109/ectc.2009.5074117openalex-snapshot
Thin hermetic passivation of semiconductors using low temperature borosilicate glass - benchmark of a new wafer-level packaging technology
inferredcites →https://doi.org/10.1109/ectc.2010.5490760openalex-snapshot
glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects
inferredcites →https://doi.org/10.1109/ectc.2010.5490961openalex-snapshot
Glass carrier based packaging approach demonstrated on a parallel optoelectronic transceiver module for PCB assembling

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

inferred← citeshttps://doi.org/10.2139/ssrn.4460327openalex-extracted
Generation of Through Glass Via (Tgv) Using Bessel Beam, Ultrashort Double Pulse Bursts Laser and Selective Chemical Etching
inferred← citeshttps://doi.org/10.1002/9783527670109.ch04openalex-snapshot
Interposer Technology
inferred← citeshttps://doi.org/10.1002/pssb.202000589openalex-snapshot
Large‐Scale Fabrication of Surface Ion Traps on a 300 mm Glass Wafer
inferred← citeshttps://doi.org/10.1002/sdtp.18369openalex-snapshot
81‐1: Preparation Process of Through Glass Via Based on Laser Induced Deep Etching
inferred← citeshttps://doi.org/10.1007/978-94-017-9038-3_2openalex-snapshot
Electrical Modeling of a Through Silicon Via
inferred← citeshttps://doi.org/10.1007/978-981-95-6891-8_1openalex-snapshot
Advanced Packaging
inferred← citeshttps://doi.org/10.1007/978-981-95-6891-8_3openalex-snapshot
Glass Packaging
inferred← citeshttps://doi.org/10.1007/s00339-023-06526-zopenalex-snapshot
Rapid and complex dynamics of through glass via formation using a picosecond quasi-continuous wave laser as revealed by time-resolved absorptance measurements and multiphase modeling
inferred← citeshttps://doi.org/10.1007/s00542-015-2449-zopenalex-snapshot
Investigation of fused silica glass etching using C4F8/Ar inductively coupled plasmas for through glass via (TGV) applications
inferred← citeshttps://doi.org/10.1007/s40436-022-00420-2openalex-snapshot
Manufacturability and mechanical reliability study for heterogeneous integration system in display (HiSID)
inferred← citeshttps://doi.org/10.1007/s40684-026-00903-8openalex-snapshot
Thermally and Structurally Robust Design of Through Glass via Arrays Using Multi-objective Optimization and Machine Learning-Based Geometry Prediction
inferred← citeshttps://doi.org/10.1016/b978-0-12-817786-0.00034-7openalex-snapshot
Through-substrate vias based three-dimensional interconnection technology
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Via Technologies for MEMS
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Introduction to HR-Si interposer technology
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Enhanced dielectric properties of Ca2+ doped Li-Al-Si photoetchable glass
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The effects of La2O3 doping on the photosensitivity, crystallization behavior and dielectric properties of Li2O-Al2O3-SiO2 photostructurable glass
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Effect of Al2O3 on structural dynamics and dielectric properties of lithium metasilicate photoetchable glasses as an interposer technology for microwave integrated circuits
inferred← citeshttps://doi.org/10.1016/j.ceramint.2020.07.306openalex-snapshot
Effect of B-doping, UV exposure and thermal annealing on dielectric properties and crystallization behavior of Li-Al-Si photoetchable glasses
inferred← citeshttps://doi.org/10.1016/j.ceramint.2020.08.248openalex-snapshot
Influence of exposure energy and heat treatment conditions on through-glass via metallization of photoetchable glass interposers
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Effect of SiO2/Li2O content on structure and physicochemical properties of photosensitive glass-ceramics
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Through-silicon via advanced packaging technology and its radio frequency applications
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Selective metallization of glass with improved adhesive layer and optional hydrophobic surface
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Impact of alkaline earth oxides on dielectric properties of photoetchable glasses as interposers for integrated circuits packaging
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Micromachined substrate integrated waveguides with electroplated copper vias in reflowed glass substrate for millimeter-wave applications
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Analytical and finite element modeling of through glass via thermal stress
inferred← citeshttps://doi.org/10.1016/j.microrel.2022.114487openalex-snapshot
In-situ temperature-dependent characterization of copper through glass via (TGV)
inferred← citeshttps://doi.org/10.1016/j.microrel.2024.115477openalex-snapshot
Thermo-mechanical reliability of glass substrate and Through Glass Vias (TGV): A comprehensive review
inferred← citeshttps://doi.org/10.1016/j.phpro.2012.10.072openalex-snapshot
Advances in CO2-Laser Drilling of Glass Substrates
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A comprehensive review on the fabrication of glass microstructures via wet bulk micromachining in HF-based etchants with different masks
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Holes generation in glass using large spot femtosecond laser pulses
inferred← citeshttps://doi.org/10.1088/1361-6439/ac628eopenalex-snapshot
Etch the borosilicate glass to form a straight through-glass-via based on the FLACE technology
inferred← citeshttps://doi.org/10.1088/1361-6463/aba1adopenalex-snapshot
Steering of surface discharges on through-glass-vias combined with high-density nonequilibrium atmospheric pressure plasma generation
inferred← citeshttps://doi.org/10.1088/1742-6596/1885/3/032045openalex-snapshot
Effect of ZnO on dielectric properties of Li-Al-Si photoetchable glasses as an interposer
inferred← citeshttps://doi.org/10.1109/3dic.2013.6702321openalex-snapshot
Glass interposer with high-density three-dimensional structured TGV for 3D system integration
inferred← citeshttps://doi.org/10.1109/access.2018.2861886openalex-snapshot
Through-Glass Vias for Glass Interposers and MEMS Packaging Applications Fabricated Using Magnetic Assembly of Microscale Metal Wires
inferred← citeshttps://doi.org/10.1109/access.2019.2925073openalex-snapshot
V-Band End-Fire Radiating Planar Micromachined Helical Antenna Using Through-Glass Silicon Via (TGSV) Technology
inferred← citeshttps://doi.org/10.1109/access.2020.2964709openalex-snapshot
Via-Monopole Based Quasi Yagi-Uda Antenna for W-Band Applications using Through Glass Silicon via (TGSV) Technology
inferred← citeshttps://doi.org/10.1109/apemc53576.2022.9888588openalex-snapshot
Signal Integrity with Ultra-Low Latency in Heterogeneous Integration System in Display (HiSID)
inferred← citeshttps://doi.org/10.1109/cstic55103.2022.9856753openalex-snapshot
Design and Fabrication of High-Q IPDS for Process Design Kits on Glass Substrate
inferred← citeshttps://doi.org/10.1109/ectc.2010.5490760openalex-snapshot
glassPack — A 3D glass based interposer concept for SiP with integrated optical interconnects
inferred← citeshttps://doi.org/10.1109/ectc.2011.5898571openalex-snapshot
Design, fabrication and characterization of low-cost glass interposers with fine-pitch through-package-vias
inferred← citeshttps://doi.org/10.1109/ectc.2011.5898579openalex-snapshot
Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications
inferred← citeshttps://doi.org/10.1109/ectc.2013.6575595openalex-snapshot
Thermomechanical and electrochemical reliability of fine-pitch through-package-copper vias (TPV) in thin glass interposers and packages
inferred← citeshttps://doi.org/10.1109/ectc.2013.6575687openalex-snapshot
Copper-filled anodic aluminum oxide: A potential substrate material for a high density interconnection
inferred← citeshttps://doi.org/10.1109/ectc.2013.6575754openalex-snapshot
High frequency characterization and analytical modeling of through glass via (TGV) for 3D thin-film interposer and MEMS packaging
inferred← citeshttps://doi.org/10.1109/ectc.2014.6897264openalex-snapshot
High performance IPDs (Integrated passive devices) and TGV (Through glass via) interposer technology using the photosensitive glass
inferred← citeshttps://doi.org/10.1109/ectc.2014.6897426openalex-snapshot
First demonstration of reliable copper-plated 30μm diameter through-package-vias in ultra-thin bare glass interposers
inferred← citeshttps://doi.org/10.1109/ectc.2014.6897427openalex-snapshot
Through-glass interposer integrated high quality RF components
inferred← citeshttps://doi.org/10.1109/ectc.2014.6897492openalex-snapshot
Development of a high density glass interposer based on wafer level packaging technologies
inferred← citeshttps://doi.org/10.1109/ectc.2014.6897536openalex-snapshot
CO2-laser drilling of TGVs for glass interposer applications
inferred← citeshttps://doi.org/10.1109/ectc.2015.7159682openalex-snapshot
Thin glass based electro-optical circuit board (EOCB) with through glass vias, gradient-index multimode optical waveguides and collimated beam mid-board coupling interfaces
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Defect mitigation of plasma-induced delamination of TiW/Cu from SiNx layer in thin si interposer processing with glass carriers
inferred← citeshttps://doi.org/10.1109/ectc.2015.7159818openalex-snapshot
Ultrathin glass wafer lamination and laser debonding to enable glass interposer fabrication
inferred← citeshttps://doi.org/10.1109/ectc.2016.233openalex-snapshot
Low Cost, High Density Interposers in Aluminum Oxide Films
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End-to-End Integration of a Multi-die Glass Interposer for System Scaling Applications
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Warpage Characterization of Glass Interposer Package Development
inferred← citeshttps://doi.org/10.1109/ectc.2019.00273openalex-snapshot
3D Printed Interposer Layer for High Density Packaging of IoT Devices
inferred← citeshttps://doi.org/10.1109/ectc32696.2021.00263openalex-snapshot
Investigation of Copper and Glass Interaction in Through Glass Via (TGV) During Thermal Cycling
inferred← citeshttps://doi.org/10.1109/ectc51529.2024.00093openalex-snapshot
Development of Glass core substrate with the stress analysis, transmission characteristics and reliability
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Development of Glass Core Substrates for Long-Term Reliability Under Thermal Stress
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Glass-Core Substrate versus Organic-Core Substrate
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High-Aspect-Ratio, 6-μm-Diameter Through-Glass-via Fabrication into 100-μm-Thick ENA1 by Dry Laser Micro-Drilling Process
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Photonic system integration by applying microelectronic packaging approaches using glass substrates
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From 3D-IC to 3D-HI for Environmentally Durable Rugged Electronics (EnDuRE)
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Performance and reliability study of TGV interposer in 3D integration
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Characterization of anodic bondable LTCC for wafer-level packaging
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Strategies for glass based photonic system integration
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Reliability test for integrated Glass interposer
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Effect of additives on copper electroplating profile for TSV filling
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Design and fabrication of a TSV interposer for SRAM integration
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Study of glass metallization and adhesion evaluation for TGV application
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The failure analysis of 30um*200um TSV interposer
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Fabrication and Characterization of SOI Based Interposer with Air Gapped Si-TSV for 2.5D Integration
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X-shaped Through Glass Via and Its Transmission Performance in Ka Band
inferred← citeshttps://doi.org/10.1109/icept52650.2021.9568206openalex-snapshot
Glass Reflow and Thermo-Mechanical Stress Simulation for Through Glass Via in Glass-Silicon Composite Interposer
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Three Dimensional Wafer-level Vacuum Packaging of MEMS Resonant Accelerometer
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Failure Mechanisms Investigation of Through Glass via (TGV) Under Thermal Annealing and Shock
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A Novel Homogenization Strategy for the Equivalent Modelling of Glass Substrates
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Mechanical behavior of glass with different roughness and its influence on TGV reliability
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Glass Packaging and Its Reliability
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Tapered polymer waveguides with graded-index core for low-loss optical VIA
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Design and Fabrication of High Density 3D IPDs (Integrated Passive Devices) on Glass Substrate
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Through glass via thermomechanical analysis: Geometrical parameters effect on thermal stress
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Investigation of the process for glass interposer
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The electrical characterizations of glass interposer for integrated reliability test
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Warpage characterization of glass interposer for BGA package application
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Novel interposer scheme for 3D integration
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Evolution, challenge, and outlook of TSV, 3D IC integration and 3d silicon integration
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Thermomechanical Reliability Implications of Copper Filler Scaling in Through-Glass Via Structures
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Thermal investigation of silicon and glass interposer-based microelectronic systems
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Optimization of copper filled Through Package Via geometry to minimize thermal induced stresses at Glass - TPV interface in Borosilicate glass interposer
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Fabrication of Vacuum-Sealed Capacitive Micromachined Ultrasonic Transducers With Through-Glass-Via Interconnects Using Anodic Bonding
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Fabrication of 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Arrays on Insulating Substrates With Through-Wafer Interconnects Using Sacrificial Release Process
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RF Glass Technology Is Going Mainstream: Review and Future Applications
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Large Scale 3D Silicon Interposer Based Interconnection for Next Generation High Performance Computational Systems
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Maskless manufacturing of through glass vias (TGVS) and their test structures
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Low-Cost Thin Glass Interposers as a Superior Alternative to Silicon and Organic Interposers for Packaging of 3-D ICs
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Electrical Modeling and Analysis of Tapered Through-Package via in Glass Interposers
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Composite Glass-Silicon Substrates Embedded With Microcomponents for MEMS System Integration
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FE Simulation Model for Warpage Evaluation of Glass Interposer Substrate Packages
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A TSV-Based 3-D Electromagnetic Bandgap Structure on an Interposer for Noise Suppression
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Modeling and Characterization of Annealing Effect on the Cu Protrusion and Thermomechanically Behaviors of Through Glass Via
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Low-Power and ppm-Level Multimolecule Detection by Integration of Self-Heated Metal Nanosheet Sensors
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Coupled Finite Element Analysis and Phase Field Modeling of Thermomechanical Fracture in Through-Glass Vias for Advanced Packaging
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Fabrication of capacitive micromachined ultrasonic transducers with through-glass-via interconnects
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A 2D Capacitive Micromachined Ultrasonic Transducer (CMUT) Array with Through-Glass-Via Interconnects Fabricated Using Sacrificial Etching Process
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Hybrid photonic system integration using thin glass platform technology
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Laser ablation of borosilicate glass with high power shaped UV nanosecond laser pulses
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Low-loss optical single-mode waveguide platform in thin glass with wide spectral range
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Optical tools for laser machining along six orders of magnitude
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Porous Anodic Aluminum Oxide Interposer: Fabrication, Characterization, and Evaluation
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Superconformal Filling of High Aspect Ratio through Glass Vias (TGV) for Interposer Applications Using TNBT and NTBC Additives
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Bismuth Substitution’s Influence on the Structural, Optical, Dielectric, and Radiation‐Shielding Properties of the Borosilicate Glass System
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Thermally and structurally robust design of through-glass via arrays via multi-objective optimization and machine learning-based geometry prediction
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Conductive Cu Paste as a via Filling Material for Through Glass via (TGV)
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Sintered Cu Paste as a Via-Filling Material for Through-Glass Via
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Cu/Polyimide Multilayer Interconnections Fabricated by Nanoimprint at Every Lithography Process
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Nanostructure Based Sensors for Gas Sensing: from Devices to Systems
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Ultrathin Antenna-in-Package Based on TMV-Embedded FOWLP for 5G mm-Wave Applications
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Reliability Assessment of Thermocompressed Epoxy Molding Compound through Glass via Interposer Architecture by the Submodeling Simulation Approach
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Research on the Protrusions Near Silicon-Glass Interface during Cavity Fabrication
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Thermo-Mechanical Reliability Study of Through Glass Vias in 3D Interconnection
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Fabrication of Substrate-Integrated Waveguide Using Micromachining of Photoetchable Glass Substrate for 5G Millimeter-Wave Applications
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Research of Vertical via Based on Silicon, Ceramic and Glass
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Study of Through Glass Via (TGV) Using Bessel Beam, Ultrashort Two-Pulses of Laser and Selective Chemical Etching
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The Effects of Etchant on via Hole Taper Angle and Selectivity in Selective Laser Etching
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Millimeter-Wave Substrate Integrated Waveguide Using Micromachined Tungsten-Coated Through Glass Silicon Via Structures
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Fabrication and Packaging of CMUT Using Low Temperature Co-Fired Ceramic
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Development of 3D Wafer Level Hermetic Packaging with Through Glass Vias (TGVs) and Transient Liquid Phase Bonding Technology for RF Filter
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Recent Research and Packaging Application of Through Glass Via Technology for Artificial Intelligence Semiconductor
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Stress Issues in 3D Interconnect Technology Using Through Glass Vias
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Flip Chip on Glass-Core Substrates with Microbump and Cu-Cu Hybrid Bonding
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Glass Packaging for Chiplets Heterogeneous Integration
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Study of Warpage and Mechanical Stress of 2.5D Package Interposers during Chip and Interposer Mount Process
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RF Device Integration on Glass Interposer toward 3D-IPAC Packages
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Thermal Characteristic and Performance of the Glass Interposer with TGVs (Through-Glass Via)
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Fabrication and characterization of advanced through glass via interconnects
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Ultra-thin glasses for semiconductor packaging
inferred← citeshttps://doi.org/10.4071/isom-2016-wp25openalex-snapshot
Glass Based Inductors, Capacitors and System-In-Package for RF Applications
inferred← citeshttps://doi.org/10.4314/star.v1i4.98823openalex-snapshot
Flexible Smart Display with Integrated Graphics Rasterizor using Single Grain TFTs
inferred← citeshttps://doi.org/10.48550/arxiv.1811.10386openalex-snapshot
CMUT on Glass Substrate for Next-Generation Medical Imaging and Beyond
inferred← citeshttps://doi.org/10.5104/jiepeng.5.107openalex-snapshot
FEM Analysis on Mechanical Stress of 2.5D Package Interposers
inferred← citeshttps://doi.org/10.7736/jkspe.025.062openalex-snapshot
Analysis of TGV Formation on Glass Substrates according to SLM Image
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