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Ni-Alloyed Cu@Sn Core-Shell Powders Enabling Highly efficient and reliable Cu-Cu TLPS bonding: Ni-Accelerated Cu6Sn5 Growth with Concomitant Cu3Sn Inhibition

https://doi.org/10.2139/ssrn.5984399
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Outgoing claims: the papers this work cites, builds on, or argues with.

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Study on the Kinetics of Ni3Sn4 Growth and Isothermal Solidification in Ni-Sn TLPS Bonding Process
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Microstructural Evolution of Ni-Sn Transient Liquid Phase Sintering Bond during High-Temperature Aging
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Effect of Bonding Time on Microstructure and Shear Property of Cu/In-50Ag/Cu TLP Solder Joints
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Cracking and phase stability in reaction layers between Sn-Cu-Ni solders and Cu substrates
inferredcites →https://doi.org/10.1016/j.intermet.2016.06.004openalex-snapshot
Micro-mechanical and fracture characteristics of Cu 6 Sn 5 and Cu 3 Sn intermetallic compounds under micro-cantilever bending
inferredcites →https://doi.org/10.1016/j.jallcom.2013.10.204openalex-snapshot
Transient liquid phase Ag-based solder technology for high-temperature packaging applications
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Enhancing the solid/liquid interfacial metallurgical reaction of Sn+Cu composite solder by ultrasonic-assisted chip attachment
inferredcites →https://doi.org/10.1016/j.jmapro.2022.01.045openalex-snapshot
Microstructural evolution and performance of high-tin-content Cu40Sn60 (wt. %) core/shell powder TLPS bonding joints
inferredcites →https://doi.org/10.1016/j.matdes.2016.06.099openalex-snapshot
Die attach materials with high remelting temperatures created by bonding Cu@Sn microparticles at lower temperatures
inferredcites →https://doi.org/10.1016/j.matdes.2017.06.022openalex-snapshot
Microstructure evolution and thermostability of bondline based on Cu@Sn core-shell structured microparticles under high-temperature conditions
inferredcites →https://doi.org/10.1016/j.msea.2007.07.093openalex-snapshot
Nanoindentation identifications of mechanical properties of Cu6Sn5, Cu3Sn, and Ni3Sn4 intermetallic compounds derived by diffusion couples
inferredcites →https://doi.org/10.1016/j.mseb.2010.10.003openalex-snapshot
State of the art of high temperature power electronics
inferredcites →https://doi.org/10.1016/j.tca.2018.03.006openalex-snapshot
A study of Ni 3 Sn 4 growth dynamics in Ni-Sn TLPS bonding process by differential scanning calorimetry
inferredcites →https://doi.org/10.1063/1.351487openalex-snapshot
Thermal and electrical properties of copper-tin and nickel-tin intermetallics
inferredcites →https://doi.org/10.1080/14786435.2017.1313466openalex-snapshot
Effect of Ni on growth kinetics, microstructural evolution and crystal structure in the Cu(Ni)–Sn system
inferredcites →https://doi.org/10.1109/jproc.2002.1021562openalex-snapshot
Silicon carbide benefits and advantages for power electronics circuits and systems
inferredcites →https://doi.org/10.1143/jjap.40.3044openalex-snapshot
Dynamic Strain and Chip Damage during Ultrasonic Flip Chip Bonding
inferredcites →https://doi.org/10.1557/jmr.2020.194openalex-snapshot
Microstructure and mechanical property of Cu/In–45Cu/Ni solder joints formed by transient liquid phase bonding
inferredcites →https://doi.org/10.3390/app9030529openalex-snapshot
Transient Liquid Phase Bonding of Copper Using Sn Coated Cu MWCNT Composite Powders for Power Electronics
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