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Coefficient of thermal expansion and elastic modulus of thin films
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What this work says
Outgoing claims: the papers this work cites, builds on, or argues with.
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Thermal Expansion and Grüneisen Parameters of Amorphous Silicon: A Realistic Model Calculation
inferredcites →https://doi.org/10.1109/t-ed.1987.22981openalex-snapshot
Measurement and Interpretation of stress in aluminum-based metallization as a function of thermal history
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Linear thermal expansion coefficient and biaxial elastic modulus of diamondlike carbon films
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Deep States in a-Si:H - Changes with Doping and Applied Stress.
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Incoming claims: where this work appears in other papers’ reference lists and arguments.
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Pressure-induced physical changes of noble gases implanted in highly stressed amorphous carbon films
inferred← citeshttps://doi.org/10.1103/physrevb.71.155419openalex-snapshot
Microstructure dependence of low-temperature elastic properties in amorphous diamondlike carbon films
inferred← citeshttps://doi.org/10.1109/ectc.2004.1319444openalex-snapshot
Simultaneously determining Young's modulus, coefficient of thermal expansion, Poisson ratio and thickness of thin films on silicon wafer
inferred← citeshttps://doi.org/10.1109/ectc51687.2025.00172openalex-snapshot
Validated Methodology for Accurate Simultaneous Measurement of Elastic Modulus and CTE of BEOL Materials for Improved Advanced Package Performance Prediction
inferred← citeshttps://doi.org/10.1109/jmems.2016.2548485openalex-snapshot
Investigation of Thermal Expansion Effects on Si-Based MEMS Structures
inferred← citeshttps://doi.org/10.1109/jstqe.2019.2936937openalex-snapshot
Monolithic Integration of CMOS Temperature Control Circuit and Si3N4 Microring Filters for Wavelength Stabilization Within Ultra Wide Operating Temperature Range
inferred← citeshttps://doi.org/10.1109/laedc49063.2020.9073473openalex-snapshot
Modeling and simulation of MEMS test structures using finite element method for stress mapping in thin film coatings
inferred← citeshttps://doi.org/10.1109/tcapt.2008.921651openalex-snapshot
Mechanical Properties of Ni$_{3}$Sn$_{4}$ and Cu$_{3}$Sn Determined by Inverse Method
inferred← citeshttps://doi.org/10.1109/tsm.2024.3410513openalex-snapshot
Advances in the Thermal Study of Polymers for Microelectronics Using the Thermally Induced Curvature Approach
inferred← citeshttps://doi.org/10.1111/ijag.15478openalex-snapshot
Simultaneous measurement of coefficient of thermal expansion and biaxial modulus of enamel thick films deposited on glass substrates by curvature technique
inferred← citeshttps://doi.org/10.1115/1.1448522openalex-snapshot
A Technique for Deducing In-Plane Modulus and Coefficient of Thermal Expansion of a Supported Thin Film
inferred← citeshttps://doi.org/10.1116/1.1365130openalex-snapshot
Hard graphitic-like amorphous carbon films with high stress and local microscopic density
inferred← citeshttps://doi.org/10.1116/1.1560714openalex-snapshot
Metallization schemes for radio frequency microelectromechanical system switches
inferred← citeshttps://doi.org/10.1116/1.1591747openalex-snapshot
Effects of stress on electron emission from nanostructured carbon materials
inferred← citeshttps://doi.org/10.1116/1.4774326openalex-snapshot
Structural, surface, and thermomechanical properties of intrinsic and argon implanted tetrahedral amorphous carbon
inferred← citeshttps://doi.org/10.1116/1.4896761openalex-snapshot
Determination of thin film coefficient of thermal expansion and residual strain from freestanding fixed–fixed beams
inferred← citeshttps://doi.org/10.1117/12.2033802openalex-snapshot
Cryogenic optical profilometry for the calculation of coefficient of thermal expansion in thin films
inferred← citeshttps://doi.org/10.1140/epjb/e2016-60583-yopenalex-snapshot
Mechanical properties of metallic thin films: theoretical approach
inferred← citeshttps://doi.org/10.1143/jjap.47.5623openalex-snapshot
On-Wafer Characterization of Thermomechanical Properties of Isotropic Thin Films Deposited on Anisotropic Substrates
inferred← citeshttps://doi.org/10.1155/2017/5826527openalex-snapshot
The Effect of Stress in the Density of States of Amorphous Carbon Films Determined by X-Ray Excited Auger Electron Spectroscopy
inferred← citeshttps://doi.org/10.1364/josab.32.001214openalex-snapshot
Thermomechanical characterization of on-chip buckled dome Fabry–Perot microcavities
inferred← citeshttps://doi.org/10.1364/oe.18.024917openalex-snapshot
Hollow Bragg waveguides fabricated by controlled buckling of Si/SiO_2 multilayers
inferred← citeshttps://doi.org/10.1364/oe.437507openalex-snapshot
Determination of the temperature-dependent optical properties of amorphous silicon films at elevated temperatures
inferred← citeshttps://doi.org/10.15251/cl.2024.212.113openalex-snapshot
Comparative study by simulation betweentwo structures CdS/CZTS and ZnS/CZTS via SCAPS-1D software
inferred← citeshttps://doi.org/10.1557/adv.2018.405openalex-snapshot
Thermal Evaporated Bismuth Triiodide (BiI3) Thin Films for Photovoltaic Applications
inferred← citeshttps://doi.org/10.1557/adv.2018.593openalex-snapshot
Stress, Hardness and Elastic Modulus of Bismuth Triiodide (BiI3)
inferred← citeshttps://doi.org/10.1557/jmr.2006.0318openalex-snapshot
Effect of stress on the aluminum-induced crystallization of hydrogenated amorphous silicon films
inferred← citeshttps://doi.org/10.1557/jmr.2020.320openalex-snapshot
Simple nanoindentation-based method for determining linear thermal expansion coefficients of micro-scale materials
inferred← citeshttps://doi.org/10.1557/proc-795-u11.29openalex-snapshot
Temperature Dependence of Biaxial Modulus and Thermal Expansion Coefficient of Thin Films Using Wafer Curvature Method
inferred← citeshttps://doi.org/10.22161/ijaers/3.11.15openalex-snapshot
Thermal and Elastic Properties of Thin Films
inferred← citeshttps://doi.org/10.32657/10356/46439openalex-snapshot
Thermal stress analysis and characterization of thermo-mechanical properties of thin films on an elastic substrate
inferred← citeshttps://doi.org/10.3390/coatings11020153openalex-snapshot
Out-of-Plane Thermal Expansion Coefficient and Biaxial Young’s Modulus of Sputtered ITO Thin Films
inferred← citeshttps://doi.org/10.3390/ma18091904openalex-snapshot
Mechanical Stress-Induced Defects in Thick a-PbO Layers
inferred← citeshttps://doi.org/10.3390/physics5010005openalex-snapshot
Study on the Thermodynamic Properties of Thin Film of FCC Interstitial Alloy AuSi at Zero Pressure Using the Statistical Moment Method
inferred← citeshttps://doi.org/10.35848/1347-4065/ac8143openalex-snapshot
Annealing effects on epitaxial (K,Na)NbO 3 thin films grown on Si substrates
inferred← citeshttps://doi.org/10.35848/1347-4065/ace5b7openalex-snapshot
Improvement of piezoelectric properties of epitaxial (K,Na)NbO3 thin films grown on Si substrates
inferred← citeshttps://doi.org/10.7907/m69r-3a76openalex-snapshot
Thin Metastructures with Engineered Thermal Expansion
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