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Influence of Filler Content and Filler Size on the Curing Kinetics of an Epoxy Resin

https://doi.org/10.3390/polym11111797
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What this work says

Outgoing claims: the papers this work cites, builds on, or argues with.

inferredcites →https://doi.org/10.1002/1521-3900(200105)169:1<171::aid-masy171>3.0.co;2-yopenalex-snapshot
The effects of silica fillers on the gelation and vitrification of highly filled epoxy-amine thermosets
inferredcites →https://doi.org/10.1002/1521-3935(200211)203:15<2196::aid-macp2196>3.0.co;2-uopenalex-snapshot
Cure Behavior of the Liquid-Crystalline Epoxy/Carbon Nanotube System and the Effect of Surface Treatment of Carbon Fillers on Cure Reaction
inferredcites →https://doi.org/10.1002/app.1979.070240302openalex-snapshot
Effect of fillers on kinetics of epoxy cure
inferredcites →https://doi.org/10.1002/app.1992.070441012openalex-snapshot
Effects of curing accelerators on physical properties of epoxy molding compound (EMC)
inferredcites →https://doi.org/10.1002/app.20631openalex-snapshot
TTT‐cure diagram of an anhydride‐cured epoxy system including gelation, vitrification, curing kinetics model, and monitoring of the glass transition temperature
inferredcites →https://doi.org/10.1002/pat.1178openalex-snapshot
Curing kinetics of the epoxy system diglycidyl ether of bisphenol A/isophoronediamine by Fourier transform infrared spectroscopy
inferredcites →https://doi.org/10.1002/pat.2063openalex-snapshot
Thermal conductivity epoxy resin composites filled with boron nitride
inferredcites →https://doi.org/10.1002/pen.10471openalex-snapshot
Comparative study of the cure kinetics of an unsaturated polyester resin using different procedures
inferredcites →https://doi.org/10.1002/pen.760130110openalex-snapshot
Kinetics and thermal characterization of thermoset cure
inferredcites →https://doi.org/10.1002/pen.760271104openalex-snapshot
A kinetic model for curing reactions of epoxides with amines
inferredcites →https://doi.org/10.1002/pen.760330404openalex-snapshot
Chemorheology of unfilled and filled epoxy resins
inferredcites →https://doi.org/10.1007/bf03218998openalex-snapshot
A low-viscousity, highly thermally conductive epoxy molding compound (EMC)
inferredcites →https://doi.org/10.1007/s10853-012-6409-zopenalex-snapshot
Effect of nanoclay and carboxyl-terminated (butadiene-co-acrylonitrile) (CTBN) rubber on the reaction induced phase separation and cure kinetics of an epoxy/cyclic anhydride system
inferredcites →https://doi.org/10.1016/0040-6031(76)80056-1openalex-snapshot
Differential scanning calorimetry of epoxy cure: isothermal cure kinetics
inferredcites →https://doi.org/10.1016/j.eurpolymj.2007.01.025openalex-snapshot
Influence of fillers and additives on the cure kinetics of an epoxy/anhydride resin
inferredcites →https://doi.org/10.1016/j.ijengsci.2012.03.022openalex-snapshot
Effects of particle shape on the macroscopic and microscopic linear behaviors of particle reinforced composites
inferredcites →https://doi.org/10.1016/j.polymer.2007.01.018openalex-snapshot
Cure kinetics, morphology and miscibility of modified DGEBA-based epoxy resin – Effects of a liquid rubber inclusion
inferredcites →https://doi.org/10.1016/j.polymer.2010.05.056openalex-snapshot
Autocatalytic curing kinetics of thermosetting polymers: A new model based on temperature dependent reaction orders
inferredcites →https://doi.org/10.1016/j.polymertesting.2012.09.011openalex-snapshot
Cure kinetics and viscosity modelling of a high-performance epoxy resin film
inferredcites →https://doi.org/10.1016/s0032-3861(00)00473-0openalex-snapshot
Effect of poly(styrene- co -acrylonitrile) on the curing of an epoxy/amine resin
inferredcites →https://doi.org/10.1016/s0141-3910(03)00090-9openalex-snapshot
Thermal stabilities and mechanical properties of epoxy molding compounds (EMC) containing encapsulated red phosphorous
inferredcites →https://doi.org/10.1088/2053-1591/3/10/105303openalex-snapshot
Effect of graphene oxide sheet size on the curing kinetics and thermal stability of epoxy resins
inferredcites →https://doi.org/10.1109/3476.558549openalex-snapshot
Mechanical failure in COB-technology using glob-top encapsulation
inferredcites →https://doi.org/10.14314/polimery.2011.240openalex-snapshot
A relationship between the glass transition temperature and the conversion degree in the curing reaction of the EPY epoxy system
inferredcites →https://doi.org/10.3390/ma12111811openalex-snapshot
The Effects of Silica-Based Fillers on the Properties of Epoxy Molding Compounds
inferredcites →https://doi.org/10.3390/polym10040457openalex-snapshot
Thermal Conductivity of Aluminosilicate- and Aluminum Oxide-Filled Thermosets for Injection Molding: Effect of Filler Content, Filler Size and Filler Geometry

What points at this work

Incoming claims: where this work appears in other papers’ reference lists and arguments.

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Curing and rheological study of epoxy molding compound with novel phosphonium silicate latent accelerators
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Micro/nano fillers for value‐added polymer composites: A comprehensive review
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inferred← citeshttps://doi.org/10.1016/j.jmrt.2022.03.102openalex-snapshot
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inferred← citeshttps://doi.org/10.1016/j.tca.2024.179745openalex-snapshot
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inferred← citeshttps://doi.org/10.1039/d1ra05234aopenalex-snapshot
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Characterization and Finite Element Modeling for Thermoset Resin of Carbon Fiber Prepregs During Curing
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Correlation between the Flow and Curing Behavior of Hard Magnetic Fillers in Thermosets and the Magnetic Properties
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